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@ <br />ZepSoLar <br />o <br />zep ZS COI,IP I GROUNDiNG AND EONDING <br />ZS Comp" I Grounding and Bonding <br />Interlock <br />Key Side Bonding <br />/, <br />This document describes the mechanics of how the etectricat bonding is accomptished between the UL <br />Listed hardware components used in Zep Sotar's ZS Comp mounting solution for composition shingte <br />roofs. <br />Zep Compatabte'' systems do not require runninq copper conductors to each modute. The act of physicatty <br />instatling each component simuttaneously estabtashes an electricat bond, as described in the fottowing <br />pages. <br />Side view <br />Fsc€d inlPiEC. durnq rolat6 <br />ol lnl6lo.* l.D a$ 1..$ ro <br />clt lhrqrqh ,'.di.al@ @ modrk <br />lm€ rcrlln9 <br />'n <br />Eid rn U, <br />Tongue Side Bonding <br />Imqm d. m do!.n ooslion <br />I_rI"r|ts) <br />ZS Comp Cutaway lllustration <br />r ..drr.ridft.b.lrarutinqprrslrmmoddr <br />.cx in mrm ot' rlo Fodrl? ,rfle r.laarS <br />rodn.ru.nn ,.:drno n r.U!i rd lr. ertlll.d <br />etr <br />I <br />I <br />oG!@nI Bl]O r47S m Rn A rfrr.t .....@n <br />O2013/tNt.!Sotu h..Z!,Sot rpffift nqhl lo m& sO.dt'olkns clnrq.r$dntary Fldrctia Allr8rts 6..vtd <br />0.t. L.( Enrild tup 25 20131 45 Ptt <br />PAGE: lof5 oo.!@it 3@ 14rc ml nd A rn{Fd..oD <br />O 2013/tN l., Sol{ hc l.p Soln,.ffi th€ rlghl lo mce lD.dtElbn! ds.qle tndt d, pnd notjr A{ ngnBrEn.d <br />0.t. LBt tr@.t d $m25 ml34 45tll <br />PAGE: 2 015 <br />- <br />I <br />I <br />n <br />I :E\' <br />I