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Zep Solar ZSCOMPIGROUNDINGANDBONDING ZepSolar ZSCOMPIGROUNDINGANDBONDING <br />Interlock, continued Leveling Foot <br />Tongue side <br />.9 <br />Part No 850-1388 <br />UL Listed to UL 2703 <br />Keyside <br />Jgo - - spring clip <br />Bonding Path - Key and Tongue <br />Part No 8504397 <br />UL Listedto UL 2703 <br />The Interto ck hon ds modules on all 4 sides to create a hyper· <br />bonded array where every module is structurally and <br />electrically bonded to the surrounding modules. <br />The Leveling Foot top portion (the Rockit) hasa stainlessstee! <br />spring clip that bonds to the adiacent module frame on both <br />Keyand Tonguesides <br />Module -t <br />Leveling Foot - Bonding With Module Frame <br />X1/ <br />C0 <br />Interlock -- <br />Tongue side <br />/ 1 Kevside <br />Down·roof .2) <br />Key side inserts into Zep Groove (rock-in)Module in next row drops in on the Tongue side <br />Bonding Path - Array Bonding Path - North and South Modules <br />Bonding location on <br />*4-1 »- 0- 717 =Interlock Keyside <br />Bonding path Leveling Foot-9_ <br />'K Bonding path <br />=/Ll· <br />41, 01-1,1 4 0 -714 k kr '04 0 <br />Down-roof <br />8onding location on <br />$ Down•001 Tongue side <br />Module rotation during drop-in creates forced <br />interference between Zep Groove and spring clip, <br />cutting into module irame, removing anodization and <br />resulting in robust and UL certified bonding patti <br />Document 800·1478-001 Rev A www.zepsoler.com <br />©2013/EN Zep Solar. Inc Zep Solar reserves the right to make specifications chnages without any prior notice AN rightsreserved <br />Datelast Exported: June25.2013 4:45 PM <br />PAGE: 3 of 5 <br />Document 800-1478-001 Rev A www.zepsolar.com <br />© 2013/EN Ze p Solar.Inc. Ze p Solar reserves the right to make specifications chnages without any prior notice. Alt rights reserved. <br />Date Last Exported· June 25,2013 4 45 PM <br />PAGE: 4 of 5