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LepSolar ZS COMP I GROUNDING AND BONDING <br />ZepSolar <br />Interlock <br />Interlock ZepZS Comp™ 1 Grounding and Bonding <br />This document describes the mechanics of how the electrical bonding is accomplished between the UL <br />Listed hardware components used in Zep Solar's ZS Comp mounting solution for composition shingle <br />roofs. <br />Zep Compatible™ systems do not require running copper conductors to each module. The act of physically <br />installing each component simultaneously establishes an electrical bond, as described in the following <br />pages. <br />ULListedtoUL2703 <br />p Tongue side <br />1 <br />Key Side Bonding <br />1 . Cutting "tooth» <br />Side view <br />1 1 <br />4 4 •Module <br />Ground Zep Intertock (Key side shown) <br />,·roof <br />Intertock <br />Key sidein <br />closed position <br />Bonding locations <br />Zep Compatible module <br />with Zep Groove <br />Cutting -tooth-on Keyside Forced interference during rotation <br />of tnterlock Zep causes teeth to <br />cut through anodization on module <br />frame, resulting in robust and UL <br />certified bonding path <br />Ed Tongue Side Bonding <br />63 Tongue side in closed position <br />Leveling FootDown / <br />ZS Comp Cutaway Illustration -44 a <br />Cutting -teeth <br />lodule <br />Bonding location on - <br />Tongueside <br />Forced interference between mating parts from module <br />rock-in motion cuts into module frame, removing <br />anodization and resulting in robust and ULcertified <br />bonding path <br />Document 800-1478-001 Rev A www.zepsolar.com <br />© 2013/EN Zep Sotar, Inc. Zep Solar reserves the right to make speci fications chnages without any prior notice. All rights reserved. <br />Date Last Exported: June 25,2013 4:45 PM <br />PAGE: I of 5 <br />Document 800-1478·001 Rev A www.zepsolar.com <br />© 2013/EN Zep Sotar, tnc. Zep Solar reserves the right to make specifications chnage5 without any prior notice. All rights reserved. <br />Date Last Exported: June 25,2013 4:45 PM <br />PAGE: 2 of 5