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JAN. 12, 2024 <br />#Description <br />2024-106 <br />DATE: <br />PROJECT NO.: <br />drawing no. <br />drawing title <br />Date <br />GENERAL CONTRACTOR <br />stamp <br />STATE OF CALIFORNIA <br />REGISTERED PROFESS IONAL ENGINEER <br />BAO D . PHAM <br />C I V I L <br />EXP. 06-30-2026 <br />C 60087 <br />20 <br />1 <br />4 <br /> <br />W <br /> <br />H <br />e <br />m <br />l <br />o <br />c <br />k <br /> <br />W <br />a <br />y <br />, <br /> <br />U <br />n <br />i <br />t <br /> <br /># <br />2 <br />Sa <br />n <br />t <br />a <br /> <br />A <br />n <br />a <br />, <br /> <br />C <br />A <br /> <br />9 <br />2 <br />7 <br />0 <br />4 <br />Re <br />s <br />i <br />d <br />e <br />n <br />c <br />e <br />NE <br />W <br /> <br />A <br />D <br />U <br />BDP Engineering, Inc. <br />7744 Westminster Blvd, Suite 201 <br />Westminster, CA 92683 <br />Phone: (909) 538-7067 <br />Email: bao@bdpeng.com <br />ELECTRICAL FLOOR PLAN1 <br />01-A-106 <br />ELECTRICAL <br />PLAN <br />· <br />· <br />EF <br />1 <br />HVAC EQUIPMENT <br />“” <br />“” <br />“” <br />“” <br />“”. <br />“” <br />SYMBOL SYSTEM <br />TYPE <br />HVAC - HEAT PUMPS <br />COOLING THERMOSTAT REMARKS <br />AC <br />1 <br />CENTRAL <br />SPLIT HP EERSEER <br />16.0 <br />SEER/SEER2 SETBACK <br />MIN. EFF.EFF.TYPE <br />HEATING <br />HSPF <br />9.5 <br />HSPF <br />MIN. EFF.EFF.TYPE <br />“ <br />” <br />EF <br />1