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£.epSolar ZS COMP I GROUNDING AND BONDING <br />Zep Solar <br />Interlock <br />Intertock Zep <br />ZS Comp™ 1 Grounding and Bonding <br />This document describes the mechanics of how the electrical bonding is accomplished between the UL <br />Listed hardware components used in Zep Solar's ZS Comp mounting solution for composition shingle <br />roots. <br />Zep Compatible™ systems do not require running copper conductors to each module. The act of physically ULListed to UL 2703 <br />installing each component simultaneously establishes an electrical bond, as described in the following 0 Tongue side <br />pages...8 ic <br />m 11 <br />·es c <br />Key Side Bonding <br />.L N{ <br />Cutting 'tooth" <br />Side view '01*W <br />Grown,OZep Interlock (Key side shownl <br />Key sidein <br />closed position <br />70n rnmn,tihlorr <br />lit. <br />4 Leveling <br />j <br />Comp Cutaway Illustration <br />"" . Interlock <br />Module <br />Bondinglocat ions <br />Cutting ·tooth' <br />with Zep Groove <br />on Key side Forced interference during rotation <br />of Interlock Zep causes teeth to <br />cut throughanodization on modulie <br />frame, resulting in robustana UL <br />certified bonding path <br />Tongue Side Bonding <br />Tongue side in closed position <br />Down·roo <br />Module <br />Cutting ·teeth"Bonding location gn <br />Tongue 5 ide <br />Forced interference belween mating parts f rom module <br />rock in motion cuts into module Irame removing <br />anodization and resulting in robust and UL certified <br />bonding path <br />Document 800-1478 001 Rev A www.zepsotar.com <br />© 2013/EN Zep Solar. Inc Zep Solar reserves the right to make specifications chnages without any prior notice All rightsreserved <br />Date LastExported June25,2013 4.45 PM <br />PAGE: 1 of 5 <br />Document 800·1478·001 Rev A www. zepsotar.com <br />©2013/EN Zep Solar. Inc ZeD Sobrreser ves the rightte nlake specilications thnages without any p.„ notice At[ rights reserved <br />Date Last Exported J une 25. 20134:45 PM <br />PAGE 2 of 5