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- -7- iaeg .1 = <br />ES.4.:,4f?M t <br />0 0 <br />ZepSolar ZSCOMPIGROUNDINGANDBONDING ZepSolar ZSCOMPI GROUNDING ANDBONDING <br />Interlock, continued Leveling Foot <br />Tongues,[le <br />Part No 85]4388 <br />F <br />Key side <br />j uld <br />-10 --- Spring clip <br />2 <br />UL Listedto UL_2703 rjo <br />Bonding Path - Key and Tongue <br />Part No 8504397 <br />UL Listed to UL 2703 <br />The Interlock bond 5 modules on al l 4 sides to create a hyper <br />bonded array where every module is structuratly and <br />electricatty bonded to the surrounding modules. <br />The Leveling Foot top portion (the Rockit) has a 51 amiess steel <br />spring clip that bonds to the adjacent module frame on both <br />Keyand TongueSides <br />Leveling Foot - Bonding With Module Frame <br />Module lili <br />4 Tongue sideliu <br />Down-roof <br />Interlock <br />Key side <br />Key side inserts into Zep Groove (rock-in)Module in next row dropsin on the Tongue side <br />Bonding Path - Array Bonding Path - North and South Modules <br />-0-4-Trk *-71 .Interlock <br />4 0 -:. Bonding path Leveling Foot <br /> Bondingpath <br />f.3 11113 1 -..11 <br />N 1/ <br /> Down·rool Down-rool <br />@111 <br />Bonding tocation on <br />Key side <br />Bondinglocation on Module rotation ou,ing drop-in creates forced <br />Tongue side intederence between Zep Groove and spring clip, <br />cutting into modute frame. removing anodization and <br />resulting in robust and UL certified bonding path <br />Document 800-1478 001 Rev A www.ze psolar.com <br />©2013/EN Zep Solar. Inc Zep Solar reserves the right to makespeciflcations chnages without any prior notice All rightsreserved <br />Date Last Exported June 25.2013 4.45 PM <br />PAGE: 4 of 5 <br />PAGE: 3 of 5 <br />Document 800-1478-001 Rev A www.zepsotar.com <br />© 2013/EN Zep Sobr. Ins. Ze#50(ar reserves the right tu make specifications thnages w it nout any prior notice. ALL rights reserved. <br />Date Last Exported June 25.2013 4:45 PM